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  1. general description the 74lv139 is a low-voltage si-gate cmos device that is pin and function compatible with 74hc139 and 74hct139. the 74lv139 is a dual 2-to-4 line decoder/demultiplexer. it has two independent decoders, each accepting two binary weighted inputs (na0 and na1) and providing four mutually exclusive outputs (n y0 to n y3) that are low when selected. each decoder has an active low input (n e). when n e is high, every output is forced high. the enable input can be used as the data input for a 1-to-4 demultiplexer application. 2. features n wide operating voltage: 1.0 v to 5.5 v n optimized for low voltage applications: 1.0 v to 3.6 v n accepts ttl input levels between v cc = 2.7 v and v cc = 3.6 v n typical output ground bounce < 0.8 v at v cc = 3.3 v and t amb = 25 c n typical high-level output voltage (v oh ) undershoot: > 2 v at v cc = 3.3 v and t amb =25 c n demultiplexing capability n two independent 2-to-4 line decoders n multifunction capability n active low mutually exclusive outputs n esd protection: u hbm jesd22-a114e exceeds 2000 v u mm jesd22-a115-a exceeds 200 v n multiple package options n speci?ed from - 40 cto+85 c and from - 40 c to +125 c 3. ordering information 74lv139 dual 2-to-4 line decoder/demultiplexer rev. 04 13 december 2007 product data sheet table 1. ordering information type number package temperature range name description version 74lv139n - 40 c to +125 c dip16 plastic dual in-line package; 16 leads (300 mil) sot38-4 74lv139d - 40 c to +125 c so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1
74lv139_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 13 december 2007 2 of 16 nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer 4. functional diagram 74lv139db - 40 c to +125 c ssop16 plastic shrink small outline package; 16 leads; body width 5.3 mm sot338-1 74lv139pw - 40 c to +125 c tssop16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 74lv139bq - 40 c to +125 c dhvqfn16 plastic dual in-line compatible thermal enhanced very thin quad ?at package; no leads; 16 terminals; body 2.5 3.5 0.85 mm sot763-1 table 1. ordering information continued type number package temperature range name description version a) demultiplexer b) decoder fig 1. logic symbol fig 2. iec logic symbol mna779 1a0 1a1 2a0 2a1 2e 1e 1y0 1y1 1y2 1y3 2y0 2y1 2y2 2y3 1 15 9 10 11 12 7 6 5 4 13 14 3 2 mna781 4 3 2 1 0 1 dx 5 6 7 0 1 2 3 g 0 3 12 13 14 1 0 15 dx (a) (b) 11 10 9 0 1 2 3 g 0 3 4 3 2 2 en en 1 1 x/y 5 6 7 0 1 2 3 12 13 14 2 1 15 x/y 11 10 9 0 1 2 3 fig 3. functional diagram mna780 1y0 1y1 1y2 1y3 7 6 5 4 1a0 1a1 1e 1 3 2 2y0 2y1 2y2 2y3 9 10 11 12 2a0 2a1 2e 15 13 14 decoder decoder
74lv139_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 13 december 2007 3 of 16 nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer 5. pinning information 5.1 pinning 5.2 pin description (1) the die substrate is attached to this pad using conductive die attach material. it can not be used as a supply pin or input. fig 4. pin con?guration dip16, so16 and (t)ssop16 fig 5. pin con?guration dhvqfn16 139 1e v cc 1a0 2e 1a1 2a0 1y0 2a1 1y1 2y0 1y2 2y1 1y3 2y2 gnd 2y3 001aad029 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 001aah107 74lv139 1y3 2y2 1y2 2y1 1y1 2y0 1y0 2a1 1a1 2a0 1a0 2e gnd 2y3 1e v cc transparent top view 7 10 6 11 5 12 4 13 3 14 2 15 8 9 1 16 terminal 1 index area v cc (1) table 2. pin description symbol pin description 1 e 1 enable input (active low) 1a0 2 address input 1a1 3 address input 1 y0 4 output 1 y1 5 output 1 y2 6 output 1 y3 7 output gnd 8 ground (0 v) 2 y3 9 output 2 y2 10 output 2 y1 11 output 2 y0 12 output 2a0 14 address input 2a1 13 address input 2 e 15 enable input (active low) v cc 16 supply voltage
74lv139_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 13 december 2007 4 of 16 nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer 6. functional description 7. limiting values [1] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] p tot derates linearly with 12 mw/k above 70 c. [3] p tot derates linearly with 8 mw/k above 70 c. [4] p tot derates linearly with 5.5 mw/k above 60 c. [5] p tot derates linearly with 4.5 mw/k above 60 c. table 3. function table h = high voltage level; l = low voltage level; x = dont care input output n e na0 na1 n y0 n y1 n y2 n y3 hxxhhhh llllhhh lhlhlhh llhhhlh l hhhhhl table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage - 0.5 +7.0 v i ik input clamping current v i < - 0.5 v or v i >v cc + 0.5 v [1] - 20 ma i ok output clamping current v o < - 0.5 v or v o >v cc + 0.5 v [1] - 50 ma i o output current v o = - 0.5 v to (v cc + 0.5 v) - 25 ma i cc supply current - 50 ma i gnd ground current - 50 - ma t stg storage temperature - 65 +150 c p tot total power dissipation t amb = - 40 c to +125 c dip16 package [2] - 750 mw so16 package [3] - 500 mw (t)ssop16 package [4] - 500 mw dhvqfn16 package [5] - 500 mw
74lv139_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 13 december 2007 5 of 16 nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer 8. recommended operating conditions [1] the static characteristics are guaranteed from v cc = 1.2 v to v cc = 5.5 v, but lv devices are guaranteed to function down to v cc = 1.0 v (with input levels gnd or v cc ). 9. static characteristics table 5. recommended operating conditions voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit v cc supply voltage [1] 1.0 3.3 5.5 v v i input voltage 0 - v cc v v o output voltage 0 - v cc v t amb ambient temperature - 40 +25 +125 c d t/ d v input transition rise and fall rate v cc = 1.0 v to 2.0 v - - 500 ns/v v cc = 2.0 v to 2.7 v - - 200 ns/v v cc = 2.7 v to 3.6 v - - 100 ns/v v cc = 3.6 v to 5.5 v - - 50 ns/v table 6. static characteristics voltages are referenced to gnd (ground = 0 v). symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max v ih high-level input voltage v cc = 1.2 v 0.9 - - 0.9 - v v cc = 2.0 v 1.4 - - 1.4 - v v cc = 2.7 v to 3.6 v 2.0 - - 2.0 - v v cc = 4.5 v to 5.5 v 0.7v cc - - 0.7v cc -v v il low-level input voltage v cc = 1.2 v - - 0.3 - 0.3 v v cc = 2.0 v - - 0.6 - 0.6 v v cc = 2.7 v to 3.6 v - - 0.8 - 0.8 v v cc = 4.5 v to 5.5 v - - 0.3v cc - 0.3v cc v v oh high-level output voltage v i = v ih or v il i o = - 100 m a; v cc = 1.2 v - 1.2 - - - v i o = - 100 m a; v cc = 2.0 v 1.8 2.0 - 1.8 - v i o = - 100 m a; v cc = 2.7 v 2.5 2.7 - 2.5 - v i o = - 100 m a; v cc = 3.0 v 2.8 3.0 - 2.8 - v i o = - 100 m a; v cc = 4.5 v 4.3 4.5 - 4.3 - v i o = - 6 ma; v cc = 3.0 v 2.4 2.82 - 2.2 - v i o = - 12 ma; v cc = 4.5 v 3.6 4.2 - 3.5 - v
74lv139_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 13 december 2007 6 of 16 nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer [1] typical values are measured at t amb = 25 c. 10. dynamic characteristics v ol low-level output voltage v i = v ih or v il i o = 100 m a; v cc = 1.2 v - 0 - - - v i o = 100 m a; v cc = 2.0 v - 0 0.2 - 0.2 v i o = 100 m a; v cc = 2.7 v - 0 0.2 - 0.2 v i o = 100 m a; v cc = 3.0 v - 0 0.2 - 0.2 v i o = 100 m a; v cc = 4.5 v - 0 0.2 - 0.2 v i o = 6 ma; v cc = 3.0 v - 0.25 0.40 - 0.50 v i o = 12 ma; v cc = 4.5 v - 0.35 0.55 - 0.65 v i i input leakage current v i =v cc or gnd; v cc = 5.5 v - - 1.0 - 1.0 m a i cc supply current v i = v cc or gnd; i o = 0 a; v cc = 5.5 v - - 20.0 - 160 m a d i cc additional supply current per input; v i = v cc - 0.6 v; v cc = 2.7 v to 3.6 v - - 500 - 850 m a c i input capacitance - 3.5 - - - pf table 6. static characteristics continued voltages are referenced to gnd (ground = 0 v). symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max table 7. dynamic characteristics gnd = 0 v; for test circuit see figure 8 . symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max t pd propagation delay nan to n yn; see figure 6 [2] v cc = 1.2 v - 70 - - - ns v cc = 2.0 v - 24 31 - 39 ns v cc = 2.7 v - 18 23 - 29 ns v cc = 3.0 v to 3.6 v; c l =15pf [3] -11- - -ns v cc = 3.0 v to 3.6 v [3] - 13 18 - 23 ns v cc = 4.5 v to 5.5 v - - 15 - 19 ns n en to yn; see figure 7 v cc = 1.2 v - 60 - - - ns v cc = 2.0 v - 20 27 - 34 ns v cc = 2.7 v - 15 20 - 25 ns v cc = 3.0 v to 3.6 v; c l =15pf [3] -10- - -ns v cc = 3.0 v to 3.6 v [3] - 11 16 - 20 ns v cc = 4.5 v to 5.5 v - - 13 - 16 ns
74lv139_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 13 december 2007 7 of 16 nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer [1] all typical values are measured at t amb =25 c. [2] t pd is the same as t plh and t phl . [3] typical values are measured at nominal supply voltage (v cc = 3.3 v). [4] c pd is used to determine the dynamic power dissipation (p d in m w). p d =c pd v cc 2 f i n+ s (c l v cc 2 f o ) where: f i = input frequency in mhz, f o = output frequency in mhz c l = output load capacitance in pf v cc = supply voltage in v n = number of inputs switching s (c l v cc 2 f o ) = sum of the outputs. 11. waveforms c pd power dissipation capacitance c l = 50 pf; f i = 1 mhz; v i = gnd to v cc [4] -42- - -pf table 7. dynamic characteristics continued gnd = 0 v; for test circuit see figure 8 . symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max measurement points are given in t ab le 8 . v ol and v oh are typical voltage output levels that occur with the output load. measurement points are given in t ab le 8 . v ol and v oh are typical voltage output levels that occur with the output load. fig 6. input (nan) to output (n yn) propagation delays fig 7. enable input (n e) to output (n yn) propagation delays mna782 t phl t plh v m v m nan input nyn output gnd v i v oh v ol mna783 ne input ny n output t phl t plh gnd v i v m v m v oh v ol table 8. measurement points supply voltage input output v cc v m v m < 2.7 v 0.5v cc 0.5v cc 2.7 v to 3.6 v 1.5 v 1.5 v 3 4.5 v 0.5v cc 0.5v cc
74lv139_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 13 december 2007 8 of 16 nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer test data is given in t ab le 9 . de?nitions test circuit: r t = termination resistance should be equal to output impedance z o of the pulse generator. r l = load resistance. c l = load capacitance including jig and probe capacitance. fig 8. load circuit for switching times v cc v i v o 001aaa663 d.u.t. c l 50 pf r t r l 1 k w pulse generator table 9. test data supply voltage input v cc v i t r , t f < 2.7 v v cc 2.5 ns 2.7 v to 3.6 v 2.7 v 2.5 ns 3 4.5 v v cc 2.5 ns
74lv139_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 13 december 2007 9 of 16 nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer 12. package outline fig 9. package outline sot38-4 (dip16) references outline version european projection issue date iec jedec jeita sot38-4 95-01-14 03-02-13 m h c (e ) 1 m e a l seating plane a 1 w m b 1 b 2 e d a 2 z 16 1 9 8 e pin 1 index b 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 0.76 4.2 0.51 3.2 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.03 0.17 0.02 0.13 dip16: plastic dual in-line package; 16 leads (300 mil) sot38-4
74lv139_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 13 december 2007 10 of 16 nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer fig 10. package outline sot109-1 (so16) x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot109-1 99-12-27 03-02-19 076e07 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1
74lv139_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 13 december 2007 11 of 16 nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer fig 11. package outline sot338-1 (ssop16) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.25 7.9 7.6 1.03 0.63 0.9 0.7 1.00 0.55 8 0 o o 0.13 0.2 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot338-1 99-12-27 03-02-19 (1) w m b p d h e e z e c v m a x a y 1 8 16 9 q a a 1 a 2 l p q detail x l (a ) 3 mo-150 pin 1 index 0 2.5 5 mm scale ssop16: plastic shrink small outline package; 16 leads; body width 5.3 mm sot338-1 a max. 2
74lv139_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 13 december 2007 12 of 16 nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer fig 12. package outline sot403-1 (tssop16) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot403-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 18 16 9 q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 a max. 1.1 pin 1 index
74lv139_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 13 december 2007 13 of 16 nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer fig 13. package outline sot763-1 (dhvqfn16) terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 3.6 3.4 d h 2.15 1.85 y 1 2.6 2.4 1.15 0.85 e 1 2.5 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot763-1 mo-241 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot763-1 dhvqfn16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 27 15 10 9 8 1 16 x d e c b a terminal 1 index area a c c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1) 02-10-17 03-01-27
74lv139_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 13 december 2007 14 of 16 nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer 13. abbreviations 14. revision history table 10. abbreviations acronym description cmos complementary metal oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mm machine model ttl transistor-transistor logic table 11. revision history document id release date data sheet status change notice supersedes 74lv139_4 20071213 product data sheet - 74lv139_3 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? section 3 : dhvqfn16 package added. ? section 7 : derating values added for dhvqfn16 package. ? section 12 : outline drawing added for dhvqfn16 package. 74lv139_3 20030313 product speci?cation - 74lv139_2 74lv139_2 19980428 product speci?cation - 74lv139_1 74lv139_1 19970212 product speci?cation - -
74lv139_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 13 december 2007 15 of 16 nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 15.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 15.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 16. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors 74lv139 dual 2-to-4 line decoder/demultiplexer ? nxp b.v. 2007. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 13 december 2007 document identifier: 74lv139_4 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 functional description . . . . . . . . . . . . . . . . . . . 4 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 recommended operating conditions. . . . . . . . 5 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 15 legal information. . . . . . . . . . . . . . . . . . . . . . . 15 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 15.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16 contact information. . . . . . . . . . . . . . . . . . . . . 15 17 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16


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